Undergraduate Courses: Mechanics of Materials; System Dynamics; Additive Manufacturing; Mechanical Design I and II; Mechanical Vibration; Capstone I and II
Graduate Courses: Mechanics of Electronic Packaging; Finite Element Method Applications; Computational Methods
Design for Additive Manufacturing: Multifunctional 3D/2D printed hybrid structures for electronics (e.g. embedded and structural electronics, and survivable electronics); Printed flexible circuits; and Energy absorbing lattice development. (http://cecs.wright.edu/~ahsan.mian/Research/)
From over 140 (http://cecs.wright.edu/~ahsan.mian/Publications.html):
- A. Fadeel, H. Abdulhadi, R. Srinivasan, and A. Mian, "A Computational Approach in Understanding the Low Velocity Impact Behavior and Damage of 3D Printed Polymer Lattice Structures," Journal of Materials Engineering and Performance, vol. 30, issue 8 AddManuf, Aug 2021 (https://doi.org/10.1007/s11665-021-05873-3) (Invited Paper)
- S. Patibandla, and A. Mian, "Layer-to-Layer Physical Characteristics and Compression Behavior of 3D Printed Polymer Metastructures Fabricated using Different Process Parameters,” Journal of Elastomers and Plastics, vol. 53, issue 5, pp. 386-401, Aug 2021 (https://doi.org/10.1177/0095244320939995)
- A. Mian, A. Hamad, S. Longstreth, A. Archacki, R. Aga, C. Bartsch, and E. Heckman, "The Effects of Printed Lattice Cell Structure Superstrates on Printed Patch Antennas,” International Journal of RF and Microwave Computer-Aided Engineering, vol. 30, issue 6, June 2021 (https://doi.org/10.1002/mmce.22655).
- A. Hamad, A. Mian, and S. Khondaker, "Direct-Write Inkjet Printing of Nanosilver Ink (UTDAg) on PEEK Substrate,” Journal of Manufacturing Processes, vol. 55, pp. 326-334, July 2020 (https://doi.org/10.1016/j.jmapro.2020.04.046).
- A. Hamad, M. Salam, and A. Mian, “Effect of Driving Waveform on Size and Velocity of Generated Droplets of Nanosilver Ink (Smartink),” Manufacturing Letters , vol. 24, pp. 14-18, April 2020 (https://doi.org/10.1016/j.mfglet.2020.03.001).
- M. Al Rifaie, A. Mian, P. Katiyar, P. Majumdar, and R. Srinivasan, “Drop-Weight Impact Behavior of Three-Dimensional Printed Polymer Lattice Structures with Spatially Distributed Vertical Struts,” Journal of Dynamic Behavior of Materials, vol. 5, issue 4, pp. 387-395, Dec 2019 (https://rdcu.be/bFCUZ, https://doi.org/10.1007/s40870-019-00199-7)
- H. Abdulhadi, and A. Mian, "Effect of Strut Length and Orientation on Elastic Mechanical Response of Modified Body-Centered Cubic Lattice Structures,” Part L: Journal of Materials: Design and Applications, vol. 233, issue 11, pp. 2219-2233, Nov 2019 (https://doi.org/10.1177/1464420719841084).
- M. Al Rifaie, A. Mian, and R. Srinivasan, “Compression Behavior of Three-Dimensional Printed Polymer Lattice Structures,”Part L: Journal of Materials: Design and Applications, vol. 233, issue 8, pp. 1574-1584, Aug 2019 (published online in April 2018,https://doi.org/10.1177/1464420718770475).
- T. Alwattar, and A. Mian, "Development of an Elastic Material Model for BCC Lattice Cell Structures using Finite Element Analysis and Neural Networks Approaches," Journal of Composites Science, vol. 3, no. 2, 33, April 2019 (https://doi.org/10.3390/jcs3020033).
- A. Fadeel, A. Mian, M. Al Rifaie, and R. Srinivasan, "Effect of Vertical Strut Arrangements on Compression Characteristics of 3D Printed Polymer Lattice Structures: Experimental and Computational Study," Journal of Materials Engineering and Performance, vol. 28, issue 2, pp. 709-716, February 2019 (https://doi.org/10.1007/s11665-018-3810-z) (Invited Paper)
- A. Hamad, and A. Mian, “Radio Frequency Response of Flexible Microstrip Patch Antennas under Compressive and Bending Loads using Multiphysics Modeling Approach,” International Journal of RF and Microwave Computer-Aided Engineering, vol. 29, issue 3, March 2019 (https://doi.org/10.1002/mmce.21649).
- S. Keerthi, A. Hamad, A. Mian, J. Clifford, P. Majumdar, N. Chamok, and M. Ali, “Effect of Heterogeneity in Additively Manufactured Dielectric Structures on RF Response of Microstrip Patch Antennas,” International Journal of RF and Microwave Computer-Aided Engineering, vol. 28, issue 4, May 2018 (http://rdcu.be/DveJ, https://doi.org/10.1002/mmce.21234).
- A. Turner, M. Al Rifaie, A. Mian, and R. Srinivasan, “Low-Velocity Impact Behavior of Sandwich Structures with Additively Manufactured Polymer Lattice Cores,” Journal of Materials Engineering and Performance, vol. 27, no. 5, pp. 2505-2512, May 2018 (https://rdcu.be/QvUv, https://doi.org/10.1007/s11665-018-3322-x)
- V.S. Tummala, A. Mian, N. Chamok, D. Poduval, M. Ali, J. Clifford, P. Majumdar, “Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications,” Journal of Electronic Packaging, vol. 139, no. 2, June 2017 (https://doi.org/10.1115/1.4036384). (Invited Paper)
- K. Rahim, and A. Mian, “A Review on Laser Processing in Electronic and MEMS Packaging,” Journal of Electronic Packaging, vol 139, no. 3, Sept. 2017 (https://doi.org/10.1115/1.4036239). (Invited Paper)
American Society for Engineering Education (ASEE)
American Society of Mechanical Engineers (ASME)